Pwosesis PCBA a tre konpleks, fondamantalman ale nan preske 50 pwosesis, ki soti nan pwosesis manifakti tablo sikwi, pwosesis eleman ak enspeksyon, SMT asanble, DIP ploge-an, PCBA tes, firing pwogram, anbalaj ak lot pwosesis enpotan. Pami yo, pwosesis la tablo sikwi manifakti gen 20-30 pwosedi, ak pwosedi yo yo tre konplike.
Figi sa a montre pwosesis la pwosesis PCBA an detay, ki pemet ou byen vit jwenn konesans pwofesyonel ki enpotan.
Sikwi teknoloji pwosesis tablo pwosesis ak ekipman
Ekipman tablo Sikwi gen ladan liy elektwoplating, fil kwiv kwiv, DES liy, liy SES, lave machin, liy OSP, peze nikel liy lo, lapres, lapres, ekspoze machin, fou, AOI, plak warping machin, kwen ki ap pile machin, koupe machin materyel, machin vakyom anbalaj, machin gong, machin kondwi, COMPRESSOR le, espre ti machin, CMI seri, limye trase, elatriye.
Wout ankadreman ka divize an model sel-sided, doub-sided ak multilayer enprime ankadreman selon kantite kouch nan model kondikte. Pwosesis la manifakti debaz nan yon panel sel se jan sa a:
Foil klas tablo->->Baking tablo (pou anpeche defomasyon) ->Mould fe->shing ak siye->Film (oswa enprime ekran) ->Exposure ak devlopman (oswa lank anti-korozyon)- ->Etching->Film retire--->Electrical kontinyel enspekte->Klean tretman->Screen enprime mask ode (enprime lwil vet)->->Screen enprime senbol make-> Ki >->Shape Pwosesis->Cleaning ak sech->Inspection->Packing->Finished Pwodwi
Pwosesis la manifakti debaz nan panel doub se jan sa a:
Pwosesis plak grafik
Foil Clad Laminate-->Cutting-->Drilling Benchmark Holes-->CNC Drilling-->Inspection-->Deburring-->Electroless Plating Thin Copper-->Electroplating Thin Copper-->Inspecting--> Brushing-->Filming (or screen printing)-->Exposure and developing (or curing)-->Inspection and repairing-->Graphic plating (Cn ten Sn/Pb)-->Removing film-->Etching- ->Inspect and repair the board-->Plugs nickel-plated and gold-plated-->Hot melt cleaning-->Electrical continuity detection-->Cleaning treatment-->Screen printing solder mask pattern-->Curing-->Screen printing mark symbol- ->Curing-->Shape processing-->Cleaning and drying-->Inspection-->Packing-->Finished product
Solder Mask Bare Copper Clad (SMOBC) pwosesis: avantaj prensipal la se ke li rezoud fenomen nan kout-sikwi nan ode bridging ant liy mens. An menm tan an, akoz rapo a konstan nan mennen nan feblan, li gen pi bon fyab ak pwopriyete depo pase cho plak cho. Pwosesis la SMOBC nan model plak ki te swiv pa retire plon-tin se menm jan ak pwosesis la plak model. Chanjman selman apre elatriye.
Double-sided kwiv mete->According pwosesis elektwoplastik la nan elatriye pwosesis->Pb-Sn remo ->Inspection-> Netwayaj--->Solder mask model->Plug nikel plak ak lo plak-> ---> Adezif kaset pou ploge->Hot nivo le->Cleaning--->Screen enprime senbol make---> Pwosesis --->Cleaning ak siye--->fini enspeksyon->Packaging->fini.
SMT chip pwosesis teknoloji
1. Dapre dosye a kliyan Gerber ak lis BOM, fe SMT pwosesis dosye ak jenere SMT dosye kowodone
2. Tcheke si tout materyel pwodiksyon yo pare, fe yon seri konple nan lod, epi konfime plan an PMC pou pwodiksyon
3. Pote soti nan pwogram SMT epi fe premye tablo a pou verifikasyon asire ke li korek
4. Dapre SMT pwosesis, fe mesh asye laze
5. Fe ode kole enprime asire keratin nan randevou apre enprime se inifom, bon epese, ak ki konsistan
6. Mete eleman yo sou tablo a sikwi nan machin nan plasman SMT, ak fe sou entenet AOI otomatik enspeksyon optik si sa nesese
7. Mete eleman yo sou tablo a sikwi nan machin nan plasman SMT, ak fe sou entenet AOI otomatik enspeksyon optik si sa nesese
8. Apre enspeksyon ki nesese IPQC ki nesese yo
9. Nan DIP Ploge-an pwosesis pase materyel la ploge-an nan tablo a sikwi ak Le sa a, koule nan vag odeur pou odeur
10. Nesese pwosesis pos-founo, tankou pye koupe, pos soude, netwayaj sifas tablo, elatriye.
11. QA fe yon enspeksyon konple asire bon jan kalite a se OK